PCB Assembly Service for Clean and Renewable Energy


For renewable energy equipment, such as solar inverters, wind power controllers, energy storage systems, etc., they require long-term exposure to complex environments and have extremely high requirements for the reliability, weather resistance, and efficiency of circuit boards.

The renewable energy equipment circuit board needs to achieve the following main functions:

Corrosion prevention (salt spray/humid heat)

Anti aging (UV/high temperature)

Anti vibration (mechanical stress)

Anti failure (redundant design)

High efficiency (>98% energy conversion rate)

Core objective: To ensure the safe and efficient operation of equipment in harsh environments within a 25 year lifecycle.

In the production and assembly process of circuit boards, we focus on the following areas:

  1. Material and substrate selection
  • High weather resistant substrate:

Using high Tg materials (Tg 170 ) to adapt to extreme temperatures (such as -40 ~+85 in desert areas).

O Moisture resistant substrate (such as Isola 370HR), with a water absorption rate of less than 0.1%, to prevent delamination in humid and hot environments.

  • Anti corrosion surface treatment:

Chemical immersion tin or ENIG (plating>1 μ m) to prevent salt spray corrosion (in accordance with IEC 60068-2-52 standard).

  • High power design:

The power layer uses copper foil with a thickness of 3 oz or more to reduce high current temperature rise (such as photovoltaic inverter current>100A).

 

  1. Manufacturing process strengthening
  • High voltage resistant design:

In high-voltage areas (such as 1500V photovoltaic systems), the creepage distance should be 8mm, and slot isolation or window opening technology should be used.

  • Heat dissipation optimization:

Aluminum substrate (thermal conductivity>2.0 W/m • K) or copper coin to reduce the junction temperature of IGBT/MOSFET.

The multi-layer board integrates a heat dissipation through-hole array to achieve rapid heat conduction.

  • Anti vibration structure:

Key components (such as electrolytic capacitors) are fixed with silicone or filled with underfill, and undergo random vibration testing at 20-2000Hz.

 

  1. Assembly and welding requirements
  • High reliability welding:

Use high-temperature lead-free solder (melting point 230 ) to adapt to the heating of high-power devices.

Vacuum reflow soldering process ensures that the void rate of large solder pads (such as DC Link capacitors) is less than 5%.

  • Anti aging process:

The photovoltaic inverter PCB is coated with polyurethane three proof paint, with a dustproof and waterproof rating of IP65.

The wind power PCB connector adopts gold-plated terminals (>0.5 μ m), which can withstand more than 500 insertions and removals.

 

  1. Environmental and safety certification
  • Extreme environment testing:

Temperature cycle: -40 ↔+ 85 , 1000 cycles (simulating a 25 year outdoor lifespan).

Damp heat test: insulation resistance>100M Ω for 1000 hours at 85 /85% humidity.

  • Safety standards:

The photovoltaic inverter needs to pass the IEC 62109-1/-2 safety certification, and the energy storage system needs to meet UL 1973.

The electrical safety distance complies with IEC 61800-5-1 (double verification of creepage distance/electrical clearance).

 

  1. Energy efficiency and EMC design
  • Low loss wiring:

The high-frequency signal layer uses ultra-low roughness copper foil (RTF/VLP, roughness<1.5 μ m) to reduce skin effect losses.

  • EMC protection:

The output end of the inverter is integrated with a common mode filter, which has passed the CISPR 11 Class A radiation test.

Sensitive signal lines are wrapped in shielding layers or grounded guard rings to suppress electromagnetic interference.

 

  1. Maintainability and Scalability
  • Modular design:

The BMS (Battery Management System) of the energy storage system supports hot swappable module replacement, with an MTTR (Mean Time to Repair) of less than 30 minutes.

Reserve communication interfaces (such as CAN/RS-485) to support future software upgrades.

  • Remote diagnosis:
Integrate temperature/voltage sensors to monitor PCB health status in real-time through IoT modules.