Quote for FPC (flexible printed circuit)

Note:The standard FPC is ordered as below (without additional charge):Polyimide Flex, 0.1MM,1 Layer, ≥ 0.06mm, ≥ φ0.15/0.35mm, Yellow Coverlay, White Silkscreen,No Gold fingers,without Stiffener, Immersion gold (ENIG) 1U", 1 oz Cu(35µm).

Length unit conversion: 1 inch'=25.4mm
1. Polyimide base material:*
One of commonly used dielectric base materials
Polyimide Flex
2. Layer(s):*
the number of conductive layers
Single panel
2 layer
4 layer
6 layer
8 layer
3. Board type:*
The full board are by only one single board or be arrayed with the same or different PCBs
Single pieces
In Panel
4. FPC Length(MM):*
Input the maximum length of the board
5. FPC Width(MM):*
Input the maximum width of the board
6. Quanlity :*
Quantity of single or panel boards
7. FPC Thickness(mm):*
The FPC thickness does not include the thickness of stiffener and 3M tape.
0.1
0.08
0.13
0.15
0.18
0.2
0.23
0.26
0.3
≥0.35
≥0.4
Other
8. Min Track/Spacing:*
Minimum width of any conductors/Minimum distance between any two adjacent trace
≥ 0.06mm
9. Min hole size/ Pad size(diameter):*
Minimum diameter of the holes and pads
≥φ0.15/0.35mm
No Drill
10. Solder Mask (Coverlay):*
Color of mask used to cover the PCB
Yellow
White
Black
None
11. Silkscreen:*
The color of text printed
White
Black
None
12. Gold fingers:*
The gold-plated terminal of a card-edge connector
No
Yes
Option
13. Stiffener:*
Material added to a flex circuit board to rigidize particular areas or perform other special functions, such as increase overall thickness; protect solder joints; heat dissipation and so on.
without
Top
Bottom
Both sides
14. Surface Finish:*
Extra process to exposed copper to help solderability
Immersion gold(ENIG)
OSP
Immersion silver(Ag)
Immersion tin
15. Thickness of Immersion Gold:*
if Surface Finish is not Immersion gold , please skip it
1μ″
2μ″
3μ″
16. Finished Copper Weight:*
The weight (in ounces) of copper present in one square foot of area. This parameter indicates the overall thickness of copper on the outer layer.
1 oz Cu(35µm)
0.5 oz Cu(18µm)
1.5 oz Cu(55µm)
2 oz Cu(70µm)
17. Electrical Test:*
Electrical test, performed with flying probes for smaller quantities or a electrical test fixure for the larger ones.
Full test
Not test
18. 3M/Tesa tape:*
Attach the whole or part of the FPC board on the other object
without
3M(Not for wave soldering)
3M 9495LE(unusual,Not for wave soldering
Tesa8853
Tesa8854
19. Position of 3M/Tesa tape:*
onesided TOP
onesided BOT
both sides
without
20. EMI shielding film:*
It is a kind of electrical functional film with high-performance shielding effectiveness.
without
HCF-6000G
PC800
21. Position of EMI shielding film:*
onesided TOP
onesided BOT
both sides
without
22. Other Special Requests:
Fill in any details to make it as clear as possible for us .
23. Gerber files(.Zip, .rar )
Gerber files are files that all circuit design software can produce.It has the effect of assisting in improving quality by arranging production preparation, manufacturing, and testing processes. Gerber file is the standard format of EIA and is divided into RS274-D and RS274-X. RS274-X is an extension file of RS274-D. it is better to provide the Gerber file of RS274-X.
24. Shipping method:
China Post epackage (about 20-45 days,Shipping cost: usd5 + usd1.5/each 100 g)
DHL(about 4days,Shipping cost: usd22 + usd8.5/each 1 kg)
Other
25. The country or region where the package is delivered:
26. Name
27. Email address
28. PCB Assembly:
No
Yes
29. Stencil:
No
Yes